Principles of Plasma Discharges and Materials Processing 3rd Edition

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Management number 220025977 Release Date 2026/05/03 List Price US$44.54 Model Number 220025977
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A new edition of this industry classic on the principles of plasma processingPlasma-based technology and materials processes have been central to the revolution of the last half-century in micro- and nano-electronics. From anisotropic plasma etching on microprocessors, memory, and analog chips, to plasma deposition for creating solar panels and flat-panel displays, plasma-based materials processes have reached huge areas of technology. As key technologies scale down in size from the nano- to the atomic level, further developments in plasma materials processing will only become more essential. Principles of Plasma Discharges and Materials Processing is the foundational introduction to the subject. It offers detailed information and procedures for designing plasma-based equipment and analyzing plasma-based processes, with an emphasis on the abiding fundamentals. Now fully updated to reflect the latest research and data, it promises to continue as an indispensable resource for graduate students and industry professionals in a myriad of technological fields. Readers of the third edition of Principles of Plasma Discharges and Materials Processing will also find: Extensive figures and tables to facilitate understandingA new chapter covering the recent development of processes involving high-pressure capacitive dischargesNew subsections on discharge and processing chemistry, physics, and diagnosticsPrinciples of Plasma Discharges and Materials Processing is ideal for professionals and process engineers in the field of plasma-assisted materials processing with experience in the field of science or engineering. It is the premiere world-wide basic text for graduate courses in the field. Read more

ISBN10 1394245378
ISBN13 978-1394245376
Edition 3rd
Language English
Publisher Wiley
Dimensions 7.4 x 1.9 x 10.1 inches
Item Weight 7.6 ounces
Print length 832 pages
Publication date October 1, 2024

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